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SY8868Q/KT*** ite and assembly operations such as

SKU: 75368478795

4.4
USD188.00 USD236.00

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Description

and assembly operations such as Flip Chip attachment to PWB substrates

It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis

ITE - 8519E

ISL 6227 CAZ

SY8868Q/KT*** ite and assembly operations such asSy 8868q KT3BA

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