Hypertec SNPC1KCNC/4G-HY (Legacy) memory module 4 GB DDR3 1333 MHz ECC SDR SDRAM Memory Memory layout (modules x

Memory Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC/server Memory form factor 240-pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3 Features Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC/server Memory form factor 240-pin DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3

2 V Memory ranking 2 ECC Yes Memory clock speed 2400 MHz Internal memory type DDR4 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for PC Memory form factor 288-pin DIMM CAS latency 17 Memory voltage 1

Memory Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1866 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1866 MHz Internal memory type DDR3

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3L Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 4 GB Internal memory 4 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3L

Hypertec SNPC1KCNC/4G-HY (Legacy) memory module 4 GB DDR3 1333 MHz ECC SDR SDRAM Memory Memory layout (modules xA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to